◆ Drilling and de-panelizing flexible printed circuit board, rigid printed circuit board, flexible-rigid printed circuit board, and chip substrate package. ◆ De-panelizing assembled flexible or rigid circuits. ◆ Precisely cutting and scribing ceramics with the thickness within 2.0mm. ◆ Precisely cutting thin copper foil, pressure sensitive adhesive, PP, acrylic sheet, polyimide film, etc. ◆ Precisely cutting ITO thin film, glass, ceramic materials, composites and polymers, organic thin film, special metal sheet, wafer and sapphire, etc. ◆ Support Roll to Roll Cutting way
Drilling and de-panelizing flexible printed circuit board, rigid printed circuit board, flexible-rigid printed circuit board, and chip substrate package. ◆ De-panelizing assembled flexible or rigid circuits. ◆ Precisely cutting and scribing ceramics with the thickness within 2.0mm. ◆ Precisely cutting thin copper foil, pressure sensitive adhesive, PP, acrylic sheet, polyimide film, etc. ◆ Precisely cutting ITO thin film, glass, ceramic materials, composites and polymers, organic thin film, special metal sheet, wafer and sapphire, etc. ◆ Support Roll to Roll Cutting way
High-performance UV Laser Source: UV Laser is a diode pumped laser source with high beam quality, high peak power, short pulse duration and stable high power pulse, which is a "cold" process that ensures the stability of cutting quality.
Total 3 pcs  FirstPage PreviousPage NextPage LastPage CurrentPage:1/1  10pcs/Page Goto: