hanzlaser.com Official Website > products > laser cutting machine > UV laser cutting machine > UV laser cutting and engraving machine500A
HZCU-500a:UV laser cutting and engraving machine500A
UV laser cutting and engraving machine500A
sliding the mouse wheel to make zoom
PRODUCT NAME:UV laser cutting and engraving machine500A
MODEL:HZCU-500a
◆ Drilling and de-panelizing flexible printed circuit board, rigid printed circuit board, flexible-rigid printed circuit board, and chip substrate package. ◆ De-panelizing assembled flexible or rigid circuits. ◆ Precisely cutting and scribing ceramics with the thickness within 2.0mm. ◆ Precisely cutting thin copper foil, pressure sensitive adhesive, PP, acrylic sheet, polyimide film, etc. ◆ Precisely cutting ITO thin film, glass, ceramic materials, composites and polymers, organic thin film, special metal sheet, wafer and sapphire, etc. ◆ Support Roll to Roll Cutting way

Characteristics

 High-performance UV Laser Source: UV Laser is a diode pumped laser source with high beam quality, high peak power, short pulse duration and stable high power pulse, which is a "cold" process that ensures the stability of cutting quality.

◆ Optimized Optical System: This system ensures processing accuracy with lower power consumption, smaller spot size, higher beam quality, and supports autofocus function.

◆ Control System: High resolution linear gauge ensures the location accuracy and repeatability

.◆ Natural Granite Platform: Natural and massive granite base reduces the inertia vibration of the table during start-up, shut-down and acceleration. At the same time, it maintains temperature stability.

◆ Air Bearing Design: Air bearings are used due to their high precision, long-term stability, frictionless motion and easy maintenance.

◆ Software: smart laser micromachining application platform, that is user-friendly, and supports most industrial data formats. 

 

 

 Model

HZCU-500a

Cutting Area

110mmX110mm,Fix Working Stable

Accuracy

±18μm

Repeatability Of X/Y Table

±1μm

Repeatability Of Z Axis

±3μm

Power Rate

5w

Drilling Speed

200holes/S

Laser Wavelength

355nm

Laser Repetition Rate

20KHz~100KHz

Power Consumption

3.0KW/2KW

Operating Temperature

20±3℃

Input Data Format

Gerber, DXF, HPGL, Sieb&Meyer, Excellon, PCB

Input Voltage

3Φ, 380V / 220V, 50/60Hz, Single Phase

Compressed Air Pressure

0.8Mpa

Machine Size(LxWxH)

850mm X 710mm X650mm

Weight

300kG

 

  • mobile

Application Range

◆ Drilling and de-panelizing flexible printed circuit board, rigid printed circuit board, flexible-rigid printed circuit board, and chip substrate package.

◆ De-panelizing assembled flexible or rigid circuits.

◆ Precisely cutting and scribing ceramics with the thickness within 2.0mm.

◆ Precisely cutting thin copper foil, pressure sensitive adhesive, PP, acrylic sheet, polyimide film, etc. ◆ Precisely cutting ITO thin film, glass, ceramic materials, composites and polymers, organic thin film, special metal sheet, wafer and sapphire, etc. ◆ Support Roll to Roll Cutting way

product
Search product
Online Contuslting
msn:zgzg1125@hotmail.com
skype:lisaseekcn
QQ-contact us
Hanzlaser On
  Hanzlaser on Facebook
http://www.facebook.com/
  hanzlaser on youtube
http://www.youtube.com/user/Hanz..
  Hanzlaser on Twitter
https://twitter.com/hanzlaser1
  hanzlaser on Wikipedia
http://en.wikipedia.org/wiki/Mai..
  hanzlaser in linkedin
www.linkedin.com