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HZCU-500:UV laser cutting machine HZCU-500
UV laser cutting machine HZCU-500
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PRODUCT NAME:UV laser cutting machine HZCU-500
MODEL:HZCU-500
Drilling and de-panelizing flexible printed circuit board, rigid printed circuit board, flexible-rigid printed circuit board, and chip substrate package. ◆ De-panelizing assembled flexible or rigid circuits. ◆ Precisely cutting and scribing ceramics with the thickness within 2.0mm. ◆ Precisely cutting thin copper foil, pressure sensitive adhesive, PP, acrylic sheet, polyimide film, etc. ◆ Precisely cutting ITO thin film, glass, ceramic materials, composites and polymers, organic thin film, special metal sheet, wafer and sapphire, etc. ◆ Support Roll to Roll Cutting way

Characteristics

High-performance UV Laser Source: UV Laser is a diode pumped laser source with high beam quality, high peak power, short pulse duration and stable high power pulse, which is a "cold" process that ensures the stability of cutting quality.

◆ Optimized Optical System: This system ensures processing accuracy with lower power consumption, smaller spot size, higher beam quality, and supports autofocus function.

◆ Control System: High resolution linear gauge ensures the location accuracy and repeatability

.◆ Natural Granite Platform: Natural and massive granite base reduces the inertia vibration of the table during start-up, shut-down and acceleration. At the same time, it maintains temperature stability.

◆ Air Bearing Design: Air bearings are used due to their high precision, long-term stability, frictionless motion and easy maintenance.

◆ Software: smart laser micromachining application platform, that is user-friendly, and supports most industrial data formats. 

 

 Model

HZCU-500

Cutting Area

110mmX110mm,fix working stable

Accuracy

±18μm

Repeatability of X/Y Table

±1μm

Repeatability of Z Axis

±3μm

Power rate

5w

Drilling Speed

200holes/s

Laser Wavelength

355nm

Laser Repetition Rate

20KHz~100KHz

Power Consumption

3.0KW/2KW

Operating Temperature

20±3℃

Input Data Format

Gerber, DXF, HPGL, Sieb&Meyer, Excellon, PCB

Input Voltage

3Φ, 380V / 220V, 50/60Hz, Single phase

Compressed Air Pressure

0.8Mpa

Machine Size(LxWxH)

850mm x 710mm x650mm

Weight

300kG

 

  • UV laser cutting machine

Application Range

◆ Drilling and de-panelizing flexible printed circuit board, rigid printed circuit board, flexible-rigid printed circuit board, and chip substrate package.

◆ De-panelizing assembled flexible or rigid circuits.

◆ Precisely cutting and scribing ceramics with the thickness within 2.0mm.

◆ Precisely cutting thin copper foil, pressure sensitive adhesive, PP, acrylic sheet, polyimide film, etc. ◆ Precisely cutting ITO thin film, glass, ceramic materials, composites and polymers, organic thin film, special metal sheet, wafer and sapphire, etc. ◆ Support Roll to Roll Cutting way

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